Water flows around the vertical two-dimensional bend with circular streamlines and constant velocity as shown in Fig. P3.12. If the pressure is 40 kPa at point (1), determine the pressures at points (2) and (3). Assume that the velocity profile is uniform as indicated.

Ahelical coil spring has a mean diameter of 50 mm, a wire diameter of 5.5 mm and is wound with a pitch of 10 mm. the spring steel has an ultimate strength of 1250 mpa. find the force needed to compress the spring solid and the wire stress in this condition. state whether the spring will return to its initial length.

Liquid flows at steady state at a rate of 2 lb/'s through a pump, which operates to raise the elevation of the liquid 100 ft from control volume inlet to exit. the liquid specific enthalpy at the inlet is 40.09 btu/lb and at the exit is 40.94 btub. the pump requires 3 btu/s of power to operate. if kinetic energy effects are negligible and gravitational acceleration is 32.174 tt/s, the heat transfer rate associated with this steady state process is most closely 1)-2,02 btu/s from the liquid to the surroundings 2)-3.98 btu/s from the surroundings to the liquid. 3)-4.96 btu/s from the surroundings to the liquid. 4)-1.04 btu/s from the liquid to the surroundings.

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction