Integrated circuits consist of electric channels that are etched onto silicon wafers. a certain proportion of circuits are defective because of "undercutting," which occurs when too much material is etched away so that the channels, which consist of the unetched portions of the wafers, are too narrow. a redesigned process, involving lower pressure in the etching chamber, is being investigated. the goal is to reduce the rate of undercutting to less than 5%. out of the first 1000 circuits manufactured by the new process, only 35 show evidence of undercutting. can you conclude that the goal has been met?

first one is a: renaming a fraction. second one is c: de-c

step-by-step explanation:

my explanation is that these were the answers on edg : )

40 minutes

step-by-step explanation:

add the time and multiply by 2

answer:

it is general formula that is used to write value to its excet position

a11 a12 a13

a21 a22 a23

it is the example of order 2 by 3 matrix in this

a11 means value occur in 1 st row 1st column

a12 means value occurs in 1st row 2nd column

a13 means value occur in 1st row and 3rd column

a21 means value occurs in 2nd row and 1st column

a22 means value occurs in 2nd row and in 2nd column

a23 means value occurs in 2nd row and in 3rd column

b