This background applies to the next several questions. assume a 15 cm diameter wafer has a cost of 12, contains 84 dies, and has 0.020 defects/cm2. assume a 20 cm diameter wafer has a cost of 15, contains 100 dies, and has 0.031 defects/cm2.

find the yield for both wafers. 2. find the cost per die for both wafers. 3. if the number of dies per wafer is increased by 10% and the defects per area unit increases by 15%, find the die area and yield. 4. assume a fabrication process improves the yield from 0.92 to 0.95. find the defects per area unit for each version of the technology given a die area of
200mm2

1)

2)

3)

And for the new yield we need to take in count the increase of 15% for the area and we got this:

4) =0.0426 defects/cm^2

=0.0260defects/cm^2

Step-by-step explanation:

Part 1

For this part first we need to find the die areas with the following formula:

Now we can use the yield equation given by:

And replacing we got:

Part 2

For this part we can use the formula for cost per die like this:

And replacing we got:

Part 3

For this case we just need to calculate the new area and the new yield with the same formulas for part a, adn we got:

And for the new yield we need to take in count the increase of 15% for the area and we got this:

Part 4

First we can convert the area to cm^2 and we got 2 cm^2 the yield would be on this case given by:

And if we solve for the Defect rate we got:

Now we can find the previous and new defect rate like this:

=0.0426 defects/cm^2

And for the new defect rate we got:

=0.0260defects/cm^2

no

step-by-step explanation:

2-7=-5

7-2=5

when you combing like terms for ech expression, 5 and -5. these numbers are not equal to each other.

1 3 5

step-by-step explanation:

i took the test: )