Engineering, 06.07.2019 02:30 khalilh1206
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
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Engineering, 04.07.2019 03:10
What precautions should you take to prevent injuries when dealing with heavy loads?
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Engineering, 04.07.2019 18:10
Steel is coated with a thin layer of ceramic to protect against corrosion. what do you expect to happen to the coating when the temperature of the steel is increased significantly? explain.
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Engineering, 04.07.2019 18:10
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Engineering, 04.07.2019 18:20
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1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides...
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