Calculate the wire pressure for a round copper bar with an original cross-sectional area of 12.56 mm2 to a 30% reduction of area, given that the included die angle is 300 with a coefficient of friction (μ) of 0.08 and the yield stress for copper is 350 mpa.

If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.

Afluid flows with a velocity field given by v=(x/t)i.. determine the local and convective accelerations when x=3 and t=1.

What is the heat treatment of metals? what is the benefit of it? why and how it's useful? answer in details, do not write by hand.