Athin silicon chip and an 8mm thick aluminum substrate (k = 240w/m. k) are separated by 0.025mm thick epoxy joint. the thermal contact resistance between silicon and aluminum is 0.9 x 10^-4 w/m^2. k. the chip and the substrate are each 10mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 27°c and provides a convection coefficient of 110w/m^2.k. if the chip dissipates 104w/m^2 under normal condition determine the maximum temperature it will operate.