Asilicon boule has been processed through grinding to provide a cylinder whose diameter 285 mm and whose length 900 mm. next, it will be sliced into wafers 0.7 mm thick usinga cut-off saw with a kerf 0.5 mm. the wafers thus produced will be used to fabricate as many ic chips as possible for the personal computer market. each ic has a market value to the company of r98. each chip is square with 15 mm on a side. the processable area of each wafer is defined by a diameter 270 mm. estimate the value of all of the ic chips that could be produced, assuming an overall yield of 80% good product.