The yield of good chips in multiprobe for a certain batch of wafers is 75%. the wafers have a diameter of 300 mm with a processable area that is 280 mm in diameter. if the defects are all assumed to be point defects, determine the density of point defects using the bose-einstein method of estimating yield.

Ahot wire operates at a temperature of 200°c while the air temperature is 20°c. the hot wire element is a tungsten wire of 5 um diameter and 2 mm in length. plot using excel current, heat transfer and heat generated by the wire for air velocity varying from 1-10 m/s in steps of lm/s? matlab the sensor voltage output, resistance, or assume nu 0.989 re033pr13 take air properties at tr (200°c20°c)/2 = 110°c properties of tungsten: c 0.13 kj/kg.k 3 p 19250 kg/m k (thermal conductivity) = 174 w/m.k