Engineering, 13.09.2019 22:30 BrandonBBB
Two wafer sizes are to be compared: a 156-mm wafer with a processable area = 150mm diameter circle and a 312-mm wafer with a processable area = 300mm diameter circle. the ic chips in both cases are square with 10 mm on a side? assume the cut lines (streets) between chips are of negligible width. what is the percent increase in (a) wafer diameter, (b) processable wafer area, and (c) number of chips for the larger wafer size?
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Thermal stresses are developed in a metal when its a) initial temperature is changed b) final temperature is changed c) density is changed d) thermal deformation is prevented e) expansion is prevented f) contraction is prevented
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Burgers vector is generally parallel to the dislocation line. a)-true b)-false
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Slip occurs via two partial dislocations because of (a) the shorter path of the partial dislocation lines; (b) the lower energy state through partial dislocations; (c) the charge balance.
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Engineering, 04.07.2019 18:10
Ifa component is made of two or more materials with different modulus of elasticity (e), it is called a composite member and we calculate the factor·n". mention the formula for calculating n". also, ifn> 1, explain what will happen to the 1. transformed.gi) ifn 1, what will happen to the material when transformed material when
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Two wafer sizes are to be compared: a 156-mm wafer with a processable area = 150mm diameter circle...
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