Engineering, 14.09.2019 00:20 alazayavila123
A(100) silicon wafer is 700 um thick. a rectangular mask with unknown size is used to pattern the wafer before through-wafer etch. the sides of the mask window are parallel with < 110> . after through wafer etch, a window of 60um x 70um is formed on the other side of the wafer. find the size of the mask window (lwidth and length). the undercut rate is negligible.
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A(100) silicon wafer is 700 um thick. a rectangular mask with unknown size is used to pattern the wa...
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