On an exam that has normally distributed u=73 and o2=64. there is a 95% probability

Line joining liquid phase with liquid and solid phase mixture is known as: a) liquidus b) solidus c) tie line d) none of the mentioned

If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.

Determine whether or not it is possible to compress air adiabatically from k to 140 kpa and 400 k. what is the entropy change during this process?