Consider the following high-level recursive procedure:
long long int f(long long int n, long long int k) {
long long int b;
b=k+2;
if (n==0) b = 8;
else b = b + 4 * n + f(n-1,k+1);
return b + k;
}
Translate the high-level procedure f into ARMv8 machine code.

a. Use the ARMv8 preserved register convention;
b. Assume that the procedure starts at address 0x00400100;
c. Keep local variable b in X19;
d. Assume n and k are passed in X0 and X1 respectively and that the result is returned in X2.

If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.

Aloaded platform of total mass 500 kg is supported by a dashpot and by a set of springs of effective stiffness 72 kn/m. it is observed that when the platform is depressed through a distance x = 12.5 cm below its equilibrium position and then released without any initial velocity; it reaches its equilibrium position in the shortest possible time without overshoot. find the position and velocity of the loaded platform 0.10 sec. after its release. if a further load of 400 kg is added to the platform, find, i) the frequency of damped vibrations, and i) the amplitude of vibration after 2 complete oscillations, given that the initial amplitude is 15 cm.

Thermal stresses are developed in a metal when its a) initial temperature is changed b) final temperature is changed c) density is changed d) thermal deformation is prevented e) expansion is prevented f) contraction is prevented