An automobile radiator may be viewed as a cross-flow heat exchanger with both fluids unmixed. Water, which has a flow rate of 0.05 kg/s, enters the radiator at 400 K and is to leave at 330 K. The water is cooled by air that enters at 0.75 kg/s and 300 K.

(a) If the overall heat transfer coefficient is 200 W/m2 K, what is the required heat transfer surface area?

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction