Engineering, 08.04.2020 20:26 ciarra31

During experiments on laser etching of microchips for IBM, a nuclear engineer places a discshaped sample 5 mm in diameter in a vacuum chamber with surface temperature of 300 K. A 500 mW laser is then used to irradiate the sample uniformly. The sample surface can be considered ‘gray’ with an emissivity of 0.9 and can be considered ‘thin’ so that the disk temperature is uniform. In addition, a non-participating gas at a temperature of 27⁰C is used to cool the sample with a convection coefficient of 50 W/(m2K). Find the steady-state temperature of the disk

Answers: 3

Show answers

Another question on Engineering

Engineering, 04.07.2019 18:10

Which of the following refers to refers to how well the control system responds to sudden changes in the system. a)-transient regulation b)- distributed regulation c)-constant regulation d)-steady-state regulation

Answers: 1

Answer

Engineering, 06.07.2019 02:30

An electric motor is used to drive a power press which makes steel turning moment diagrams 323 pressings from a metal sheet. the motor runs at a mean speed of 50 rev/s. the torque required is 10.0nm for 0.2s, followed by 1.0nm for0.3 s with this sequence then being repeated. what is the minimum power required of the motor and the moment of incrtia required for the t1ywhcel if the speed fluctuations are to be restricted to 1.5%?

Answers: 3

Answer

Engineering, 06.07.2019 02:30

On solidification from a melt, the polymer polyethylene forms a semi-crystalline spherulite structure. (i) sketch an individual spherulite and label the amorphous and crystalline regions. (ii) draw a schematic to show the changes in specific volume with temperature during cooling from the melt, comparing it to the theoretical extremes of fully crystalline and fully amorphous (indicate tm and tg)

Answers: 2

Answer

Engineering, 06.07.2019 02:30

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction

Answers: 1

Answer

You know the right answer?

During experiments on laser etching of microchips for IBM, a nuclear engineer places a discshaped sa...

Questions