How electronic connectivity between various development teams can support software engineering activities?

Line joining liquid phase with liquid and solid phase mixture is known as: a) liquidus b) solidus c) tie line d) none of the mentioned

If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.

Draw the engineering stress-strain curve for (a) bcc; (b) fcc metals and mark important points.