Engineering, 26.01.2021 01:50 BigGirlsTheBest
A tiny chip of semiconducting material that contains many electrical circuits
Answers: 2
Engineering, 03.07.2019 14:10
If the thermal strain developed in polyimide film during deposition is given as 0.0044. assume room temperature is kept at 17.3 c, and thermal coefficient of expansion for the film and the substrate are 54 x 10^-6c^-1 and 3.3 x 10^-6c^-1respectively. calculate the deposition temperature.
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Engineering, 04.07.2019 18:10
Determine whether or not it is possible to compress air adiabatically from k to 140 kpa and 400 k. what is the entropy change during this process?
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Engineering, 04.07.2019 18:10
Which one from below is not one of the reasons of planning failures? (clo3) a)-planner is careless. b-planner spend less time in the field but more time on the desk c)-planner is not qualified d)-planner does not have sufficient time to properly plan
Answers: 3
Engineering, 04.07.2019 18:10
True or false (explain) (110)[111] is a slip system in bcc metals . the {111} family in fcc contains 8 planes. resolved shear stress (rss) in single crystals is just related to the applied stress. critical resolved shear stress (crss) in single crystal metals is direct proportional to the number of defects in the structure
Answers: 2
A tiny chip of semiconducting material that contains many electrical circuits...
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