A thin silicon chip and an 8-mm-thick aluminum substrate are separated by a 0.02-mm-thick epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed surfaces are cooled by air, which is at a temperature of 25 C and provides a convection coefficient of 100 W/m2 K. If the chip dissipates 104 W/m2 under normal conditions, will it operate below a maximum allowable temperature of 85 C

Heat is added to a piston-cylinder device filled with 2 kg of air to raise its temperature 400 c from an initial temperature of t1 27 cand pressure of pi 1 mpa. the process is isobaric process. find a)-the final pressure p2 b)-the heat transfer to the air.

When using the ohmmeter function of a digital multimeter, the leads are placed in what position relative to the component being tested? a. parallel b. control c. series d. line

Aloaded platform of total mass 500 kg is supported by a dashpot and by a set of springs of effective stiffness 72 kn/m. it is observed that when the platform is depressed through a distance x = 12.5 cm below its equilibrium position and then released without any initial velocity; it reaches its equilibrium position in the shortest possible time without overshoot. find the position and velocity of the loaded platform 0.10 sec. after its release. if a further load of 400 kg is added to the platform, find, i) the frequency of damped vibrations, and i) the amplitude of vibration after 2 complete oscillations, given that the initial amplitude is 15 cm.