subject
Engineering, 31.03.2021 03:20 dria40

This problem will take you through the steps needed to calculate the appropriate mass of Tris base, EDTA, and salt (NaCl in this example), and volume of 1 N HCL to use in the preparation of your Tris buffer stck solution for the enzyme kinetics unit. The final volume, concentrations and pH values have been randomized, and are not necessarily the values you have been assigned to use in your stock solution. The formula weight for Tris is 121.1 g/mole, EDTA is 372.2 g/mole, and NaCl is 58.44 g/mole.
Tris base is uncharged (conjugate base), and Tris-HCl has a charge of +1 (conjugate acid).
The pKa' for Tris is 8.2 (use this value in the initial calculation of the Henderson-Hasselbalch equation to determine the CB/CA ratio).
When you solve the final Henderson-Hasselbalch equation to calculate more precisely the amount of HCl to add, use the pKa (8.08) plus your calculated ΔΔpKa.
Provide three significant figures and include units, when appropriate, in your answers
You wish to make 85.0 mL of 158 mM Tris buffer pH 8.20, containing 25.5 mM EDTA and 43.5 mM NaCl.
What mass of Tris base would you need to weigh out?

ansver
Answers: 3

Another question on Engineering

question
Engineering, 04.07.2019 18:10
Refrigerant 134a enters an insulated compressor operating at steady state as saturated vapor at -26°c with a volumetric flow rate of 0.18 m3/s. refrigerant exits at 9 bar, 70°c. changes in kinetic and potential energy from inlet to exit can be ignored. determine the volumetric flow rate at the exit, in m3/s, and the compressor power, in kw.
Answers: 1
question
Engineering, 04.07.2019 18:10
Aturning operation is performed with following conditions: rake angle of 12°, a feed of 0.35 mm/rev, and a depth of cut of 1.1 mm. the work piece is aluminum alloy 6061 with t6 heat treatment (a16061-t6). the resultant chip thickness was measured to be 1.0 mm. estimate the cutting force, fc. use shear stress of 207 mpa and coefficient of friction on the tool face of 0.6.
Answers: 1
question
Engineering, 06.07.2019 02:30
1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction
Answers: 1
question
Engineering, 06.07.2019 03:10
Oxygen at 300 kpa and 400 k is in a closed system with an initial volume of 0.1 m3. is now compressed in a polytropic process, with exponent of n 1.2, to a temperature of 500 k. calculate: a) the boundary work done during the compression, in kj b) the heat transfer during the compression, in kj
Answers: 3
You know the right answer?
This problem will take you through the steps needed to calculate the appropriate mass of Tris base,...
Questions
Questions on the website: 13722363