Main circuit wiring is represented in a schematic by A. the abbreviation mcw
B. A red line
C. A darker line
D. thicker line

Air is to be cooled in the evaporator section of a refrigerator by passing it over a bank of 0.8-cm-outer-diameter and 0.4-m-long tubes inside which the refrigerant is evaporating at -20°c. air approaches the tube bank in the normal direction at 0°c and 1 atm with a mean velocity of 4 m/s. the tubes are arranged in-line with longitudinal and transverse pitches of sl- st 1.5 cm. there are 30 rows in the flow direction with 15 tubes in each row. determine (a) the refrigeration capacity of this system and (b) pressure drop across the tube bank. evaluate the air properties at an assumed mean temperature of -5°c and 1 atm. is this a good assumption?

Awall of 0.5m thickness is to be constructed from a material which has average thermal conductivity of 1.4 w/mk. the wall is to be insulated with a material having an average thermal conductivity of 0.35 w/mk so that heat loss per square meter shall not exceed 1450 w. assume inner wall surface temperature of 1200°c and outer surface temperature of the insulation to be 15°c. calculate the thickness of insulation required.

1in2 processor chip can be modelled as an isothermal plane wall of silicon, isothermal on both sides. the power input to the bottom of the plane wall, or the processing power of the chip, often called the thermal design power (tdp), is 100w. assume the periphery is adiabatic. the silicon is 400 microns thick. the temperature at the junction, or in this case on the bottom of the isothermal plane wall, is 85°c. what is the top surface temperature, assuming that the only mode of heat transfer is conduction