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Anew process has been developed for applying photoresist to 125 mm silicon wafers used in the manufacturing of integrated circuits. 10 wafers were tested and the following photoresist thickness measurements (angstrom x1000) were observed: 13.3987, 13.3957, 13.3902, 13.4015, 13.4001, 13.3918, 13.3965, 13.3925, 13.4002, 13.3946.test the hypothesis that mean thickness is 13.4 x 1000 angstroms. use \alpha = 0.05 and assume two-sided alternative.
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Anew process has been developed for applying photoresist to 125 mm silicon wafers used in the manufa...
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