Question 14 In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils/min): Solution 1 Solution 2 9.8 10.5 10.1 10.0 9.4 10.3 10.6 10.2 9.3 10.0 10.7 10.7 9.6 10.3 10.4 10.4 10.2 10.1 10.5 10.3 Test the hypothesis Upper H 0 colon sigma Subscript 1 Superscript 2 Baseline equals sigma Subscript 2 Superscript 2 against Upper H 1 colon sigma Subscript 1 Superscript 2 Baseline not-equals sigma Subscript 2 Superscript 2 using Round your answer to 3 decimal places (e. g. 98.765). Test statistic: Conclusion: H0. the tolerance is /-2%