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Engineering, 20.09.2019 01:30 wendybhenry61391

Assume a particular function in a 65nm process being used today requires a die area of 0.5cm2 and that it is fabricated on 300mm wafers that cost $3200. predictions now suggest that in a few years, high-end processes will have 7nm feature sizes on 450mm wafers. if the 450mm wafers cost $1 each, what will be the approximate cost per good die of the same function if fabricated in the new high-end process with feature sizes of 7nm?

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